ADI公司的ADAQ23878是高精度高速μModule®数据采集解决方案, 采用系统级封装(SIP)技术,通过将多个常用的信号处理和调节块集成到单个器件包括低噪声全差分ADC驱动器(FDA),稳定的基准电压源缓冲器和高速18位15 MSPS逐次逼近寄存器(SAR) ADC中来减少终端系统所含的器件数量.器件也集成采用ADI公司的iPassive®技术,具备出色的匹配和偏移特征的关键无源器件,以较大限度减少与温度相关的误差源,并提供优化性能.ADC驱动器级的快速建立和SAR ADC的零延迟特性为高通道数复用信号链架构和控制回路应用提供了一种独特的解决方案.器件采用9 mm × 9 mm小尺寸BGA封装帮助进一步减小小型仪器仪表的体积. ADAQ23878采用串行LVDS数字接口,提供单路或双路输出模式,μModule的额定工作温度范围为-40°C至+85°C. 单个5 V电源操作.主要用在ATE,数据采集,硬件在环(HiL),功率分析仪,非破坏性试验(声频发射),质谱测定,行波故障测距和医疗成像与仪器仪表.本文介绍了ADAQ2387主要特性, μModule简化框图,功能框图,多种差分输入和单端输入配置图,以及评估板EVAL-ADAQ23878FMCZ主要特性,简化框图,电路图,材料清单和PCB设计图.
The ADAQ23878 is a precision, high speed, μModule® data acquisition solution that reduces the development cycle of precision measurement systems by transferring the design burden of component selection, optimization, and layout from the designer to the device.
Using system-in-package (SIP) technology, the ADAQ23878 reduces end system component count by combining multiple common signal processing and conditioning blocks in a single device, including a low noise, fully differential ADC driver amplifier (FDA), a stable reference buffer, and a high speed, 18-bit, 15 MSPS successive
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