TI TPA3132D2 25W Class D立体声功放参考设计方案
TI公司的TPA3132D2是一款有效最大驱动2*42W/4Ω扬声器的立体声数字功率放大器。TPA3132D2芯片在驱动2*25W/8Ω时，无需使用散热片，可以通过PCB板底部的功率Pad进行散热。TPA3132D2芯片具有短路保护、过热保护、过压保护、欠压保护等，在过载的故障情况下，为保护设备会向处理器提供反馈。本文首先介绍芯片的简介、特性、内部框图及应用领域，并给出相应设计方案的设计原理图、元器件列表及PCB元件布局图。
The TPA3131/32D2 are efficient, stereo digital amplifier power stages for driving speakers with up to 2x42W/4Ω peak power. TPA3131/32D2 operates heatsink-free with cooling to PCB through the bottom side Power-Pad with sustained output power from 2x4W/8Ω (TPA3131D2) to 2x25W/8Ω (TPA3132D2).
The TPA3131/32D2 advanced oscillator/PLL circuit employs a multiple switching frequency option to avoid AM interferences; this is achieved together with an option of Master/Slave option, making it possible to synchronize multiple devices.
The TPA3131/32D2 are fully protected against faults with short-circuit protection and thermal protection as well as over-voltage, under-voltage and DC protection. Faults are reported back to the processor to prevent devices from being damaged during overload conditions.
For feature compatible devices see: Power Pad up device 2x50W TPA3116D2, Power Pad down 2x15W TPA3130D2 and 2x30W TPA3118D2.
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